Differences

This shows you the differences between two versions of the page.

--- start [2021/12/04 11:18]
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+++ start [2024/07/30 13:01] (current)
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 [[Tool Throughput Gain]]
 See how one fab improved throughput 15% on a critical toolset
+[[Tool Retrofit]]
+See how ErgoTech saved the $2.5M cost of a new tool
 [[AWS IOT Core]]
@@ Line 18: / Line 21: @@
 =====Product Support=====
+Here's a good article on SECS/GEM [[https://www.researchgate.net/publication/351845005_A_Review_on_SECSGEM_A_Machine-to-Machine_M2M_Communication_Protocol_for_Industry_40|A Review on SECS/GEM: A Machine-to-Machine (M2M) Communication Protocol for Industry 4.0]]  It gets a little technical in places but also mentions competing M2M standards.  While these are not common in Semiconductor processing (just as SECS/GEM is not used outside of Semiconductor and associated industries - Electronic assembly, Photovoltaics, LED panels, etc.) some, particularly OPC UA and many PLC protocols, are used in subfab applications.
 [[MIStudio]]
 [[TransSECS]]
+[[MIX]]
 [[scriptingdatasourcesvalueobjects|Data Sources, Value Objects, and Scripting]]
+[[databasereferencecheatsheet|Database Reference "Cheat Sheet"]]
+[[GettingStartedWithJasperReports|Reporting: Introduction to Jasper Reports]]
+[[AdvancedParametersJasperReports|Reporting: Advanced Jasper Reports (Parameters)]]
 [[ErgoTech SECS Tester|ErgoTech SECS Tester]]
@@ Line 39: / Line 49: @@
 [[Simulation and Testing]]
+[[OPCUAConfig|OPCUA Setup and Configuration]]